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2022-03-04dragonboards: Create build option to use prebuilt mesa bitsJohn Stultz
Enables the build to utilize prebuilt mesa binaries found in the 20220303 linaro-vendor-package. Also provides a TARGET_BUILD_MESA build option such that building with the aosp/master or aosp/upstream-main branches of external/mesa3d are still possible by setting: TARGET_BUILD_MESA=true Change-Id: Ibeee5cd578df6e8462427d0f3757007ed30c6148 Signed-off-by: John Stultz <john.stultz@linaro.org>
2022-02-18Factor out the full device configuration.Peter Collingbourne
In an upcoming patch we are going to add "mini" device configurations that avoid most of the usual driver dependencies. This requires splitting out the device-specific configuration from the configuration required for a full device image. Bug: 217455793 Change-Id: Id17d162d142a2595e54e163f5faaf7dcf9b68e35
2022-02-18Move the architecture definitions into the device-specific BoardConfigs.Peter Collingbourne
Newer SOC generations may have different levels of CPU feature support (e.g. SM8450 which is ARMv9), so let's allow the individual boards to specify their own sets of features. Bug: 217455793 Change-Id: I6852683ad14a8fa6b0fc22f39e0c9c7823d1da2c
2022-02-01dragonboards: Allow use of new mesa/main buildJohn Stultz
Update the db845c/rb5 build to use the mesa/main build targets if they are available. We still keep the libGLES_mesa target, so we can still properly build with AOSP's mesa branch. This just allows us to easily test upstream mesa. Signed-off-by: John Stultz <john.stultz@linaro.org> Change-Id: Icc8e3fedecb72a458a8419a1fe8bbb326fbe4b87
2022-01-14dragonboards: Move firmware files to external vendor overlay packageAmit Pundir
Moving all the vendor binaries (including bootloader, qdl and firmware binaries) to an external vendor.tgz package to be downloaded from: https://releases.linaro.org/android/aosp-linaro-vendor-package/extract-linaro_devices-20220106.tgz BUILD_BROKEN_ELF_PREBUILT_PRODUCT_COPY_FILES build flag is used to copy a few vendor firmware files to ramdisk or vendor_ramdisk to work-around the dependency of their drivers on FW_LOADER_USER_HELPER_FALLBACK kernel config. And for that we needed to bump up the boot and vendor_boot partition sizes as well. Also folded John's installer script changes into this patch. Change-Id: I1b46ee17f4a218c735e2ac8d81759364b3bf7332 Signed-off-by: Amit Pundir <amit.pundir@linaro.org> [Reworked to handle versioned vendor/linaro/<dev> paths] Signed-off-by: John Stultz <john.stultz@linaro.org>
2021-01-15Revert "db845c: Add support for cache partition"Amit Pundir
This reverts commit 70f37c65199443d2502da58ecb81a4be28d36d80. With Virtual A/B, we no longer need cache partition for "adb remount" to work with overlayfs. Signed-off-by: Amit Pundir <amit.pundir@linaro.org> Change-Id: I979e61c4a64a8d0b1c7345491f4924c1d3fa62e0
2020-10-06db845c: Add support for cache partitionJohn Stultz
Add logic to support cache partition, as it seems to be required to properly handle overlayfs remounts on the super paritition. Signed-off-by: John Stultz <john.stultz@linaro.org> Change-Id: I5c3c0eebb7e8d34cff85197855f4ea5b989b90b3
2020-03-28BoardConfigCommon.mk& fstab.ramdisk.common: update for product partitionYongqin Liu
update to use dynamic product partition, as it's mandatory now by the commit here: https://android-review.googlesource.com/c/platform/system/core/+/1264148 otherwise it will failed to boot to home screen successfully Test: db845c boot to home screen successfully Signed-off-by: Yongqin Liu <yongqin.liu@linaro.org> Change-Id: Ib777b7006ef3b46fcf93c85d301ab83e1f2f61bd
2019-09-24db845c: Add support for AOSP on dragonboard db845cAmit Pundir
Boots dragonboard db845c to console. HDMI display broken due to missing firmware files. Change-Id: I820aeb7b7ab2536a362f9ae37cc44906be0a6190 Signed-off-by: Amit Pundir <amit.pundir@linaro.org>